Qualcomm confirmed the annual Snapdragon Tech Summit which will be held this year from 24 to 26 October. The event is scheduled a month earlier than the usual date. Qualcomm will unveil its highly anticipated flagship Snapdragon 8 Gen 3 chip, showcasing the company's latest advancements in mobile technology.
No details have been officially revealed, but leaks about the upcoming Snapdragon 8 Gen 3 chip have already appeared. According to rumours, the soon-to-be-released SoC will feature an updated architecture, switching from a "1+2+2+3" setup to a "1+5+2" configuration. This change is expected to introduce a more powerful core with higher frequency. In addition, the chip will reportedly be manufactured using the TSMC N4P process, known for its advanced capabilities.
The Snapdragon 8 Gen 3, consists of 1 x Cortex-X4 prime core, 5 x A720 power cores, 2 x A520 power cores and an Adreno 750 GPU. The Adreno 750 GPU is expected to deliver a significant performance improvement over its predecessor, the Adreno 740. It is also rumoured to have 10 MB of L3 cache, compared to the previous 8 MB of L3 cache.
The performance of the new chip has also been revealed. According to Geekbench's list, the Snapdragon 8 Gen 3 scored 2563 points in the GeekBench single-core test and 7256 points in the multi-core test. Both scores are quite impressive, however the jump in multi-core test results compared to the Snapdragon 8 Gen 2 SoC shows a significant improvement. Conversely, the device scored an impressive AnTuTu score of 1,712,271 overall, with the CPU scoring 331,292 and the GPU 853,295.
This means that the Xiaomi 14 and Pro versions will be a very powerful phone, which we can expect to see in November and December. The two phones, Chinese and global versions, are already appeared in the IMEI database.
