Yesterday, you read a small summary about the Redmi K40 Gamer Enhanced Edition phone that will be released on the 27th, but it wasn't clear at the time that it will get MTK processors. This morning, Redmi announced it on their Weibo page and alongside it a never-before-used cooling technology in a phone.
The MediaTek Dimensity 1200 with new 6 nm technology has achieved a significant performance increase over the previous generation, quantified as 22%, but also a 25% increase in power efficiency. The 1200 can drive up to 168Hz screen and handle up to 200 MP camera. It can deliver different performance and power consumption from 8 cores in a triple-core configuration. Its main core (Cortex-A78) spins at 3 GHz, with 3 more large cores (Cortex-A78) at 2.6 GHz and 4 small cores (Cortex-A55) at 2 GHz.
Graphics performance is powered by the Mali-G77 MC9 GPU, which scored 724.795 points in the AnTuTu V9 performance benchmark. And for that performance, you need proper cooling, and it's not just any cooling!
The Redmi K40 Gamer Enhanced Edition phone has a total cooling surface area of 11,540 mm², which is the most brutal at the moment. But to achieve the best gaming experience, liquid cooling or the condensing material used in the Xiaomi Mi 11 Ultra isn't enough, they've turned to space technology.
Redmi has gone all the way to the heat dissipation material of space shuttles. For the first time in the world, a hexagonal boron nitride heat dissipation material, best known as Aerospace Graphene, is used in a mobile phone. A low dielectric, high thermal conductivity material used in rocket nozzles.
Thanks to its low dielectric function, it can control the rise in antenna temperature while not blocking the 5G signal. It can also provide perfect coverage of the antenna area and solve the problem of temperature dissipation and signal loss.
