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Already received Taiwanese certification last month (NCC) By the National Communications Committee the new flagship of Xiaomi.

It is the same device used by the IMDA of Singapore ( Info-Communications Media Development Authority) and China's 3C also approved.

However, the Singapore certification clearly confirms that the M1902F1G will be none other than the Mi9.

Unfortunately, the certificate doesn't tell us much about the device itself, no specific specifications are known, but we do know that it is expected to arrive soon.

The M1902F1A/T 3C (CCC) certification reveals that the device will be shipped with an MDY-08-ES charger, which will support 27W (with a maximum charging speed of 27W, 20V and 1.35A) fast charging technology. This was confirmed by the company's CEO Lei Jun.

In the photo published earlier, the Mi 9 is expected to get three rear cameras (a 48-megapixel Sony IMX586 + 12-megapixel+ 3D ToF) in a vertical layout. And the selfie camera could be a 24-megapixel Sony IMX576 sensor.

There is no fingerprint scanner on the back of the phone in the picture, so it will most likely be an improved, more accurate sensor built under the display.

According to Xiaomi Product Director Tang Weng Thomas, the Mi9 is designed by Mi Liu, who also designed the Xiaomi Mi 6.

As expected, the processor will be Snapdragon 855. As the first smartphones with 12 GB of RAM have already been released, it is likely that the Mi 9 could be the first smartphone from Xiaomi to come with more than 10 GB of RAM. According to previous reports, the Mi 9 could have a 6.4″ display (slightly larger than the Mi8) with almost no front panel.

The device is expected to be launched in the first quarter.

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