Xiaomi Mi6 ceramic on a ceramic dish also bombed!

The Xiaomi Mi6 ceramic version went on sale just five days ago and sold out almost instantly, as we wrote. We even had disassembly articles with video of the plain version, but now here's the disassembly of the ceramic edition in pictures, in detail.

About Xiaomi Mi6 click here to read more.

The first steps

Well, let's do it! What do you need? A screwdriver, suction cup, tweezers, dexterity and lots of patience.

First, remove the SIM tray.

The back is exactly the same as the Mi5 pro (ceramic) back, except for the 18K gold factory around the camera (just like the Mi Mix 128GB ceramic version) and of course the gold MI inscription on the bottom.

As we know ceramic doesn't conduct heat very well, so the Xiaomi Mi 6 has a graphite heatsink.

The standard 3-part Mi device

This is the NFC chipset used in the Ceramic Mi 6.

The Mi6 BM39 uses a built-in lithium polymer battery with a capacity of 3250mAh.

The Mi6 uses an integrated (capacitive type) fingerprint scanner, which is different from the Mi 5s' ultrasonic fingerprint scanner (Synopsis S3330) with IFS fingerprint solution. Similar to the Mi5s, without the "hole" directly into the glass face of the touchscreen like the Mi5.

Mi6 battery

The battery is glued in place and cannot be replaced.

NOTE: After reinserting the battery into the Mi6, the battery will not fit tightly without gluing and you may sometimes hear the battery wobble. So we strongly recommend that you don't take it apart.

Camera modules

This is the front camera module, an 8MP Sony Exmor IMX268 camera.

This is the Xiaomi Mi 6's rear dual camera module, which includes wide-angle and telephoto lenses, Sony Exmor IMX 386 and Samsung S5K3M3 ISP.

Feedback

The solution shown here is similar to iPhone's Taptic Engine technology, which generates feedback (sounds, vibrations) according to the user's actions.

Mi6 motherboard

This is the motherboard of the Mi6 and you can see that more insulation is used.

A summary of the different Mi6 components

  1. red: Broadcom quad-band GSM/EDGE and multi-mode amplifier # ACPMW-7800
2. purple: Main GPU / CPU
3. blue: Skyworks SkyLiTE™ amplifier module # SKY77824-11
4. cyanide: Snapdragoon X16 LTE modem # WTRWTR5975
5. green: Dual LED flash

Additional components on the motherboard

1. red: SD 835 SoC
2. green: 6 GB RAM module 2869N
3. blue: the main energy management chip
4. yellow: Secondary energy management chip
5. cyanide: SIM card compartment

All Mi6 parts laid out